Turning data into quality - thanks to WiCKON

WiCKON Hightech combines highly precise 3D AOI inspection solutions for Industry 4.0 with smart 2D analysis and seamless integration into your systems. From the lab to the production line, you can inspect components in real time, reliably detect micro-defects, and control processes based on data – for stable cycle times, less scrap, and full traceability.

Applications

Semiconductors

Electronics/PCB & Power

Medical technology

Aerospace

Energy/fuel cell

Processes

Inline inspection

Laboratory→Line (PerSpectrial)

Wet inspection (“wet & sintered”)

Wire bond

Ceramic/thick film

Technologies

Hybrid scan 3D+2D

Telecentric optics

High-throughput data handling

WiSion with API connection (OPC UA, SECS/GEM)

News from our research

Teledyne & WiCKON Hightech: New standards in 3D inspection technology

October 30, 2025

New partnership: Teledyne DALSA & WiCKON Hightech take 3D inspection technology to a new level of precision and speed.

Quantum Scan Sensor revolutionizes quality control

October 12, 2023

Quantum Scan Sensor: 10-nm 3D and full-resolution inline inspection - more precise, faster quality control for semiconductors and electronics.

Wet inspection in the fuel cell production process

October 12, 2022

WiCKON Hightech enables optical 3D inspection of wet thick-film processes in fuel cell production for the first time.

Scalable, safe, ready for series production

Precision for every industry

WiCKON Hightech brings 3D AOI inspection solutions for Industry 4.0 precisely to where quality determines success – from prototype to series production. Whether high-density circuit boards, sensitive MedTech assemblies, or sophisticated ceramic and energy components: Our modular systems integrate seamlessly into existing lines, deliver reliable measurement data in real time, and scale with your requirements.

Interested? Get in touch!

Whether individual optics, new sensor technology or a complete inline solution –WiCKON Hightech develops what you really need: precision in the middle of the process.