Full-surface, true 3D elevation images - inline, fast, scalable

3D inspection heads for maximum precision

WICKON high-tech 3D inspection heads generate full-surface, pixel-precise height images – every pixel carries height information, without interpolation and without gaps. Thanks to the large numerical aperture of ±9° to ±23.5° tilt, even reflective, wavy or tilted surfaces are reliably detected.

Real 3D instead of point clouds

Typical applications

Whether micrometer features or large-area structures – our 3D inspection heads cover a broad spectrum. From semiconductors and electronics to medical technology, aerospace, energy and military. Here you will find typical inspection tasks that we solve inline, quickly and reliably.

Semiconductors

Wafer testing incl. coating layers, BGAs/balls/cylinders, wafer warping

Electronics

SPI with 5.0 to 12.5 µm, full-surface without point cloud and interpolation.

Medical technology

3D wire bond measurement (Ø 13-320 µm), hearing aids, blood pumps, pacemakers

Aerospace

Ceramic sheathing, satellite housings, high-temperature resistant components, vehicle electronics, sensor technology

Military

Ceramic sheathing, satellite housings, high-temperature resistant components, vehicle electronics, sensor technology

Energy sector

Fuel cells (MEAs & bipolar plates – wet, dried, sintered), battery cells

The bridge between testing and production

Smoothly from the first sample to series production

Our 3D inspection heads fit seamlessly into existing production lines – from incoming inspection to wet and dry inspection to final inspection after the sintering process. Double-track concepts with around 2 s per track are just as feasible as high line cycles in series production.

We offer open interfaces for Industry 4.0 workflows: SECS/GEM, OPC UA and a high-performance API connect MES and traceability directly. Results flow into dashboards, SPC control charts and reports; recipes and test strategies can be managed centrally. This creates a scalable, future-proof process chain – from the first sample to fully automated inline acceptance.

Real 3D elevation images
Nanometer precision
Inline performance

Technical data

Lateral resolution 1.25-12.75 µm (telecentric)
Height resolution up to 240 nm (3-sigma)
Measuring range (Z) 0.3-2 mm
Line scan camera 4,096-16,384 px image width
Field of view & speed 80 × 250 mm per second 204 x 600 mm per second
3D BGA inspection Ball sizes < 20 µm
Layer thicknesses 5-30 µm inspectable
Inline performance up to 60 substrates/minute (scalable)

These values are designed for high throughput in the line and are used productively in WICKON systems.

Why 3D inspection heads from WiCKON make the difference

More value from every pixel

Our 3D inspection heads provide full-surface height information – without gaps or interpolation – and remain reliable even on reflective, wavy or tilted surfaces. The systems are fully inline-capable with very short cycle times and scale up to high line cycles. Thanks to modular optics, lighting and API connection, they integrate seamlessly into existing production lines and MES environments. The result: fewer false calls, higher yields and stable processes.

Conclusion: With pixel-perfect 3D imaging, nanometer resolution and industrial-grade integration, WICKON 3D inspection heads are a key component for safe, efficient and future-proof production – from laboratory validation to series production. If you want to measure quality that pays off in terms of results, opt for real 3D instead of point clouds and for a solution that performs today and remains scalable tomorrow.

Are you interested in our hardware, software or services? Are you interested in a product presentation? Write to us – we look forward to hearing from you!